Aluminum Silicon Carbide Al/SiC

Al SiC (alluminum silicon carbide) is a metallic-based thermal management compound made up of silicon carbide and aluminum. It is used as a packaging material for electronic parts. The combination of aluminum with high volume frac is what it refers to.

Description Al/SiC

Al SiC (Al SiC), a metallic-based thermal management compound made up of aluminum and silica carbide, is an electronic packaging material. In order to prevent thermal failures in electronic circuits, it is the mixture of aluminum with high volume fractions of silicon carbide.

Specifications for Aluminum Matrix Composites

Materials

Density = g/cm3.

Modulus of Elasticity GPa

Strength MPa

Coefficient 10-6 of expansion beats K

Thermo conductivity W/m

SiC/Al

15vol%SiC/Al

2.82

100+-5

560

17.0+-1

150+-5

20vol%SiC/Al

2.85

110+-5

580

16.0+-1

160+-5

25vol%SiC/Al

2.86

115+-5

600

14.3+-1

170+-5

30vol%SiC/Al

2.89

125+-5

560

13.1+-1

175+-5

45vol%SiC/Al

2.92

160+-5

500

11.5+-1

190+-5

55vol%SiC/Al

2.95

195+-5

450

9.5+-1

200+-5

60vol%SiC/Al

2.98

200+-5

420

8.3+-1

205+-5

65vol%SiC/Al

3.01

215+-5

400

7.5+-1

210+-5

70vol%SiC/Al

3.02

220+-5

380

7.0+-1

215+-5

Properties of Aluminum Silicon Carbide Aluminium/SiC

Silicon caride aluminum SiC/almatrix compounds have many exceptional advantages. They are ideal for high-stability optomechanical system.
Example: (1) Superior structural stability (static rigidity, dynamic stiffness): The elastic modulus of titanium alloy is twice that of the aluminum alloy, while the specific stiffness of the aluminum alloy is three times greater than the titanium alloy. (2) High thermal control stability: The coefficient of thermal expansion of titanium alloy can be as low as 20%, while the temperature conductivity of the titanium alloy is 30% higher.


Aluminum Silicon Carbide - Al/SiC

Al/SiC meets the semiconductor integration needs according to Moore's law. This results in a dramatic increase in silicon chip calorific values, decreased service lives, and "light-weight" electronic packaging development.

In aerospace especially, the use of microwave integrated circuits, power module, and military RF systems chips for packaging analysis has been a prominent trend.



Packing & Shipping of Aluminum Silicon Carbide Al/SiC :
You can choose from many kinds of packing. Aluminum Silicon Carbide Al/SiC quantity.
Aluminum Silicon Carbide Al/SiC shipping: After receipt of payment, items may be shipped by sea or air as soon as they are possible.



Inquiry us

NEXT Carbide powder

Our Latest Products

Triterpenoid Saponin Air entraining agent

Triterpenoid Saponin (a form of glycosides from tea leaves) is a natural surfactant that performs well. This surfactant can be used extensively in chemical and light industries, as well as pesticides, drinks, beverage, food, beverages, oils extractio…

Metal Alloy Fine Surface 19.15g/cm3 Tungsten Targets

By sintering tungsten, a target made of tungsten is created. Different shapes could be made to meet the needs of customers. About Metal Alloy Fine Surface 19.15g/cm3 Tungsten Targets: Chemistry: Properties: Good resistivity and therma…

Metal Alloy High Purity 99.95% Tungsten Targets

By sintering tungsten, a target made of tungsten is created. Customers may request different shapes or sizes for tungsten targets. High Purity Metal Alloy 99.95% Tungsten Targets Chemistry: Properties: Good resistivity and thermal st…

0086-0379-64280201 brad@ihpa.net skype whatsapp